工藝資訊

Cleanliness Levels of NFF (CWB) Equipment (Click HERE to download)

 

1.      Thermal Diffusion and Implantation Module

2.      Dry Etching and Sputtering Module

3.      Wet Etching and CMP Module

4.      Photolithography Module

 

Remark:

 Blue : Equipment in NFF (CWB)-EC (EC-01000)

 Black : Equipment in NFF (CWB)-Phase 2 (P2-01000 and P2-00100)

 Green: Equipment in TSV Process Laboratory (Rm. 2227)

 Red: Equipment in Deep RIE Process Center (Rm. 2223)

 Brown: Equipment for Microfluidic Process in NFF (CWB)-Phase 2

 Purple: Equipment in Nanofabrication Demonstration Laboratory (NDL) (Rm. 3114)

 

1.      Thermal Diffusion and Implantation Module

Process Code
Location
Equipment 
Cleanliness level
Cleaning
CVD
CVD-A2 P2-01000 LPCVD-A2 Doped Amor-Si Clean A3+SRD-A
CVD-A3 P2-01000 LPCVD-A3  Amor-Si/Poly Clean A3+SRD-A 
CVD-B1 P2-01000 LPCVD-B1 Low-Stress Nitride Clean A3+SRD-A 
CVD-B2 P2-01000 LPCVD-B2 Nitride Clean A3+SRD-A 
CVD-B3 P2-01000 LPCVD-B3 LTO  Clean A3+SRD-A
CVD-EPI P2-01000 ET3000 Epitaxy Clean A3+SRD-A
CVD-A4 P2-01000 LPCVD-A4  Si-Ge / Amor-Si / Poly Semi-Clean B1+SRD-B
D1 (dump-rinser)
CVD-B4 P2-01000 LPCVD-B4 LTO / PSG Semi-Clean B1+SRD-B
D1 (dump-rinser)
CVD-P1 P2-01000 310PC PECVD Semi-Clean B1+SRD-B
D1 (dump-rinser)
CVD-TEOS P2-01000 TEOS PECVD Semi-Clean B1+SRD-B
D1 (dump-rinser)
CVD-P2 P2-01000 STS PECVD Non-Standard B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
CVD-CNT P2-01000 CNT PECVD Non-Standard B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
CVD-ALD P2-01000 Oxford ALD Non-Standard B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
Thermal Diffusion
DIF-C1 P2-01000 Diff. Furnace-C1 FGA Annealing Non-Standard B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
DIF-C2 P2-01000 Diff. Furnace-C2 N Pre-Deposition Clean A3+SRD-A
DIF-C3 P2-01000 Diff. Furnace-C3 P Pre-Deposition Clean A3+SRD-A
DIF-D1 P2-01000 Diff. Furnace-D1 Dry Oxidation Clean (Only for gate oxide) A3+SRD-A 
DIF-A1 P2-01000 Diff. Furnace-A1 Anneal/Oxidation Clean  A3+SRD-A
DIF-D2 P2-01000 Diff. Furnace-D2 Dry/Wet Oxidation Clean A3+SRD-A
DIF-D3 P2-01000 Diff. Furnace-D3 Annealing/Dry/Wet Oxidation Non-Standard B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
DIF-R1 P2-01000 RTP-600S Clean A3+SRD- A
DIF-F1 P2-01000 Diff. Furnace-F1 Annealing/Dry/Wet Oxidation Semi-Clean B1+SRD-B
D1 (dump-rinser)
DIF-C4 P2-01000 Diff. Furnace-C4 FGA Annealing Semi-Clean B1+SRD-B
D1 (dump-rinser)
DIF-R2 P2-01000 AG610 RTP Semi-Clean B1+SRD-B
D1 (dump-rinser)

DIF-R3

EC-01000

AW610 RTP

Non-Standard

M1(dump-rinser)+ N2 dry

Implantation
IMP-3000 P2-01000 CF-3000 Implanter Clean/Semi-Clean  

 

2.      Dry Etching and Sputtering Module

* Remark: For Semi-Clean process of "Poly Etcher", please contact NFF (CWB) technicians.
Process Code
Location
Equipment 
Cleanliness level
Cleaning
Dry Etching
DRY-AOE P2-01000 AOE Etcher Clean  
DRY-Si-1 P2-01000 DRIE Etcher #1 Clean  

DRY-Si-2

Rm. 2223

DRIE Etcher #2

Clean/Semi-Clean

 

DRY-Si-3

Rm. 2223

DRIE Etcher #3

Non-Standard

 
DRY-Poly P2-01000 Poly Etcher Clean/Semi-Clean *  
DRY-XeF2 P2-01000 XeF2 Silicon Etcher Clean/Semi-Clean  
DRY-Trion P2-01000 Trion RIE Etcher Semi-Clean  
DRY-Metal-1 P2-01000 AST Metal Etcher Semi-Clean  
DRY-Metal-2 P2-01000 Oxford  Aluminum Etcher Semi-Clean  
DRY-GaN P2-01000 GaN Etcher Non-Standard  

DRY-RIE-1

EC-01000

Oxford RIE Etcher

Non-Standard

 
DRY-RIE-2 P2-01000 NFF RIE Etcher Semi-Clean  

DRY-Cleaner

P2-01000

Diener Plasma Cleaner

Non-Standard

Microfluidic user only

Photoresist O2 Asher
DRY-PR-1 P2-01000 PS210 Asher Clean  
DRY-PR-2 P2-01000 IPC 3000  Asher #1 Semi-Clean  
DRY-PR-3 P2-01000 IPC 3000  Asher #2 Non-Standard  

DRY-PR-4

EC-01000

IPC 3000  Asher #3

Non-Standard

 
Sputtering & Evaporation
SPT-3180 P2-01000 Varian 3180 Sputter Semi-Clean  
SPT-NSC3000 P2-01000 NSC3000 Sputter Semi-Clean  

SPT-EV1

NDL-10000

Cooke Evaporator #1

Semi-Clean

 
SPT-ARC P2-01000 ARC-12M Sputter Non-Standard  
SPT-CVC P2-01000 CVC-601 Sputter Non-Standard  

SPT-Denton

EC-01000

Denton Sputter

Non-Standard

 

SPT-EV2

EC-01000

Cooke Evaporator #2

Non-Standard

 

SPT-AST600

EC-01000

AST 600EI  Evaporator

Non-Standard

 

SPT-AST450

EC-01000

AST 450I Evaporator

Non-Standard

 

 

3.     Wet Etching and CMP Module

Process Code
Location
Equipmment 
Cleanliness Level
Remark
CMP
CMP-1 P2-10000 Strasbaugh CMP Clean  
CMP-2 P2-10000 USI Wafer Cleaner Clean  

CMP-3

Rm. 2227

Silicon Grinder

Semi-Clean

 

CMP-4

Rm. 2227

Buehler Polisher #1

Semi-Clean

 

CMP-5

Rm. 2227

Buehler Polisher #2

Non-Standard

 
Wet-station
Wetstation A - Sulfuric Cleaning Station
WET-A1 P2-01000 A1: Sulfuric Cleaning (NFF reserved) Clean   
WET-A2 P2-01000 A2:HF:H20 (1:50)  Clean   
WET-A3 P2-01000 A3: Sulfuric Cleaning  Clean  ONLY for "Clean" furnace and RTP
SRD-A P2-01000 Spin Dryer-A Clean   
Wetstation B - Sulfuic Cleaning/Decontamination Station
WET-B1 P2-01000 B1:Sulfuric Cleaning Clean NOT for "Clean" furnace and RTP
WET-B2 P2-01000 B2:HF:H20(1:50) Clean  
WET-B3 P2-01000 B3:Decontamination Clean  
SRD-B P2-01000 Spin Dryer-B Clean   
Wetstation C - Oxide/Nitride Etching Station
WET-C1 P2-01000 C1:Nitride Strip Clean  
WET-C2 P2-01000 C2:Oxide Deglaze/PSG Removal Clean  
WET-C3 P2-01000 C3:BOE Clean  
SRD-C P2-01000 Spin Dryer-C Clean   
Wetstation D - Semi-Clean Metal Processing Station
WET-D1 P2-01000 D1:Aluminum Etch Semi-Clean  
WET-D2 P2-01000 D2:HF:H2O(1:100) MILC Semi-Clean  
WET-D3 P2-01000 D3:General Purpose Semi-Clean  
WET-D4 P2-01000 D4:Sulfuric Cleaning for MILC Semi-Clean  
SRD-D P2-01000 Spin Dryer-D Semi-Clean  
Wetstaton E - Semi-Clean Non-metal Processing Station
WET-E1 P2-01000 E1:ITO Etch Semi-Clean  
WET-E2 P2-01000 E2:General Purpose Semi-Clean  
WET-E3 P2-01000 E3:HF:H2O(1:100) Semi-Clean  
WET-E4 P2-01000 E4:Resist Strip Clean/Semi-Clean  
SRD-E P2-01000 Spin Dryer-E Clean/Semi-Clean  
Wetstation F - Non-Standard Processing Station
WET-F1 P2-01000 F1:General Purpose Non-Standard  
WET-F2 P2-01000 F2:General Purpose Non-Standard  
WET-F3 P2-01000 F3:General Purpose Non-Standard  
SRD-F P2-01000 Spin Dryer-F Non-Standard  
Wetstation G - TMAH Etching Station
WET-G1 P2-01000 G1:TMAH Clean  
WET-G2 P2-01000 G2:TMAH Clean  
SRD-G P2-01000 Spin Dryer-G Clean   
Wetstation J - TMAH/KOH Etching Station
WET-J1 P2-01000 J1:TMAH/KOH Etching Non-Standard  
WET-J2 P2-01000 J2:TMAH/KOH Etching Non-Standard  

Wetstation M - Non-Standard Organic Solvent Station

WET-M1

EC-01000

M1:MS2001 Resist Strip

Non-Standard

 

WET-M2

EC-01000

Branson 5510

Non-Standard

 

WET-M3

EC-01000

M3:MS2001 Mask Cleaning

Non-Standard

 

Wetstation O - Non-Standard Hydrochloric Acid Etch Station

WET-O1

EC-01000

O1: HCl

Non-Standard

 
Wetstation W - Non-Standard Organic Solvent Station
WET-W1 P2-00100 W1:MS2001 Resist Strip Non-Standard  
WET-W2 P2-00100 W2:FHD-5  Non-Standard  
SRD-W P2-00100 Spin Dryer-W Non-Standard  
Wetstation X - Clean Organic Solvent Station
WET-X1 P2-00100 X1:General Purpose Clean  
WET-X2 P2-00100 X2:General Purpose Clean  
Wetstation Y - Semi-Clean Organic Solvent Station
WET-Y1 P2-00100 Y1:MS2001 Resist Strip Semi-Clean  
WET-Y2 P2-00100 Y2:MS2001 Mask Cleaning Semi-Clean  
SRD-Y P2-00100 Spin Dryer-Y Semi-Clean  
Wetstation Z - Semi-Clean/Non-Standard Organic Solvent Station
WET-Z1 P2-00100 Z1:FHD-5 Semi-Clean  
WET-Z2 P2-00100 Z2:Dump Rinser Semi-Clean/Non-Standard  
Critical Point Dryer

CPD-1

NDL-10000

Critical Point Dryer

Semi-Clean

 
Electroplating

EP-1

Rm. 2227

Copper Electroplating

Non-Standard

 

 

4.      Photolithography Module

Process Code
Location
Equipmment 
Cleanliness Level
Remark
Ultrasonic Bath
PHT-U1 P2-00100 Branson 5510 Semi-Clean  
PHT-U2 P2-00100 Branson 3510 Non-Standard  
Stepper/Aligner and Bonder
PHT-A7 P2-00100 Karl Suss MA6 #2 Clean/Semi-Clean  
PHT-S1 P2-00100 ASML Stepper Clean/Semi-Clean  

PHT-A1

NDL-10000

AB-M Aligner #1(UV)/(DUV)

Semi-Clean/Non-Standard

 
PHT-A2 P2-00100 AB-M Aligner #2(UV) Semi-Clean/Non-Standard  

PHT-A5

EC-01000

Karl Suss MA6 #1

Non-Standard

 
PHT-B1 P2-00100 Karl Suss Bonder SB6 Non-Standard  

EMW-1

EC-01000

JEOL JBX-6300FS E-Beam Lithography System

All Level

 
PHT-P1 P2-01000 Nanoscribe 3D Printer All Level  
Coater and Track
PHT-T1 P2-00100 SVG88 Coater Track Clean/Semi-Clean  
PHT-T2 P2-00100 SVG88 Developer Track Clean/Semi-Clean  
PHT-SC3 P2-00100 CEE Coater  Clean/Semi-Clean  
PHT-SC1 P2-00100 SUSS Coater Semi-Clean/Non-Standard  
PHT-SC2 P2-00100 Desktop Coater Non-Standard  
PHT-SC5 P2-00100 EVG Spray Coater All Level  

PHT-SC4

EC-01000

Solitec Coater #1

Non-Standard

 

PHT-SC6

P2-01000

Laurell PDMS Coater

Non-Standard

Microfluidic user only

PHT-MX1

P2-01000

Kurabo PDMS Mixer/Deaerator

Non-Standard

Microfluidic user only

Oven
PHT-O3 P2-00100 Imperial V (105C) Clean/Semi-Clean  
PHT-O4 P2-00100 Oven-C (120C) Clean/Semi-Clean  
PHT-O6 P2-00100 Oven-A (180C) Clean/Semi-Clean  
PHT-O7 P2-00100 Oven-B (80C) Clean/Semi-Clean  
PHT-O1 P2-00100 Grieve Non-Standard  
PHT-O2 P2-00100 Shellab (120C) Non-Standard  
PHT-O5 P2-00100 Vacuum Oven  Non-Standard  

PHT-O8

EC-01000

Oven-D (120C)

Non-Standard

 

PHT-O9

EC-01000

Oven-E (105C)

Non-Standard

 
Hotplate
PHT-HP1 P2-00100 Sawatec Hot Plate Clean/Semi-Clean  
PHT-HP2 P2-00100 SUSS Hot Plate Clean/Semi-Clean  
PHT-HP9 P2-00100 CEE Hot Plate #1(110C) Clean/Semi-Clean  
PHT-HP3 P2-00100 Hot Plate-C Non-Standard  
PHT-HP4 P2-00100 Hot Plate-D Non-Standard  

PHT-HP5

EC-01000

EMS Hot Plate #1 (50C)

Non-Standard

 

PHT-HP6

EC-01000

CEE Hot Plate #2 (90C)

Non-Standard

 

PHT-HP7

EC-01000

Hot Plate (110C)

Non-Standard

 
PHT-HP8 P2-00100 EMS Hot Plate #2 (50C) Non-Standard  
HMDS Primer
PHT-HM1 P2-00100 HMDS Primer #1 Non-Standard  
PHT-HM2 P2-00100 HMDS Primer #2 Clean/Semi-Clean  

PHT-HM3

EC-01000

HMDS Primer #3

Non-Standard