工藝資訊
Cleanliness Levels of NFF (CWB) Equipment (Click HERE to download)
1. Thermal Diffusion and Implantation Module
2. Dry Etching and Sputtering Module
3. Wet Etching and CMP Module
4. Photolithography Module
Remark:
Blue : Equipment in NFF (CWB)-EC (EC-01000)
Black : Equipment in NFF (CWB)-Phase 2 (P2-01000 and P2-00100)
Green: Equipment in TSV Process Laboratory (Rm. 2227)
Red: Equipment in Deep RIE Process Center (Rm. 2223)
Brown: Equipment for Microfluidic Process in NFF (CWB)-Phase 2
Purple: Equipment in Nanofabrication Demonstration Laboratory (NDL) (Rm. 3114)
1. Thermal Diffusion and Implantation Module
Process Code |
Location |
Equipment |
Cleanliness level |
Cleaning |
CVD |
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| CVD-A2 | P2-01000 | LPCVD-A2 Doped Amor-Si | Clean | A3+SRD-A |
| CVD-A3 | P2-01000 | LPCVD-A3 Amor-Si/Poly | Clean | A3+SRD-A |
| CVD-B1 | P2-01000 | LPCVD-B1 Low-Stress Nitride | Clean | A3+SRD-A |
| CVD-B2 | P2-01000 | LPCVD-B2 Nitride | Clean | A3+SRD-A |
| CVD-B3 | P2-01000 | LPCVD-B3 LTO | Clean | A3+SRD-A |
| CVD-EPI | P2-01000 | ET3000 Epitaxy | Clean | A3+SRD-A |
| CVD-A4 | P2-01000 | LPCVD-A4 Si-Ge / Amor-Si / Poly | Semi-Clean | B1+SRD-B D1 (dump-rinser) |
| CVD-B4 | P2-01000 | LPCVD-B4 LTO / PSG | Semi-Clean | B1+SRD-B D1 (dump-rinser) |
| CVD-P1 | P2-01000 | 310PC PECVD | Semi-Clean | B1+SRD-B D1 (dump-rinser) |
| CVD-TEOS | P2-01000 | TEOS PECVD | Semi-Clean | B1+SRD-B D1 (dump-rinser) |
| CVD-P2 | P2-01000 | STS PECVD | Non-Standard | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
| CVD-CNT | P2-01000 | CNT PECVD | Non-Standard | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
| CVD-ALD | P2-01000 | Oxford ALD | Non-Standard | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
Thermal Diffusion |
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| DIF-C1 | P2-01000 | Diff. Furnace-C1 FGA Annealing | Non-Standard | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
| DIF-C2 | P2-01000 | Diff. Furnace-C2 N Pre-Deposition | Clean | A3+SRD-A |
| DIF-C3 | P2-01000 | Diff. Furnace-C3 P Pre-Deposition | Clean | A3+SRD-A |
| DIF-D1 | P2-01000 | Diff. Furnace-D1 Dry Oxidation | Clean (Only for gate oxide) | A3+SRD-A |
| DIF-A1 | P2-01000 | Diff. Furnace-A1 Anneal/Oxidation | Clean | A3+SRD-A |
| DIF-D2 | P2-01000 | Diff. Furnace-D2 Dry/Wet Oxidation | Clean | A3+SRD-A |
| DIF-D3 | P2-01000 | Diff. Furnace-D3 Annealing/Dry/Wet Oxidation | Non-Standard | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
| DIF-R1 | P2-01000 | RTP-600S | Clean | A3+SRD- A |
| DIF-F1 | P2-01000 | Diff. Furnace-F1 Annealing/Dry/Wet Oxidation | Semi-Clean | B1+SRD-B D1 (dump-rinser) |
| DIF-C4 | P2-01000 | Diff. Furnace-C4 FGA Annealing | Semi-Clean | B1+SRD-B D1 (dump-rinser) |
| DIF-R2 | P2-01000 | AG610 RTP | Semi-Clean | B1+SRD-B D1 (dump-rinser) |
DIF-R3 |
EC-01000 |
AW610 RTP |
Non-Standard |
M1(dump-rinser)+ N2 dry |
Implantation |
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| IMP-3000 | P2-01000 | CF-3000 Implanter | Clean/Semi-Clean | |
2. Dry Etching and Sputtering Module
| * Remark: For Semi-Clean process of "Poly Etcher", please contact NFF (CWB) technicians. * Remark: For Semi-Clean process of "Oxford GaN-InP Etcher", please contact NFF(CWB) technicians. |
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Process
Code |
Location |
Equipment |
Cleanliness level |
Cleaning |
Dry Etching |
||||
| DRY-AOE | P2-01000 | AOE Etcher | Clean | |
| DRY-Si-1 | P2-01000 | DRIE Etcher #1 | Clean | |
DRY-Si-2 |
Rm. 2223 |
DRIE Etcher #2 |
Clean/Semi-Clean |
|
DRY-Si-3 |
Rm. 2223 |
DRIE Etcher #3 |
Non-Standard |
|
| DRY-Poly | P2-01000 | Poly Etcher | Clean/Semi-Clean * | |
| DRY-XeF2 | P2-01000 | XeF2 Silicon Etcher | Clean/Semi-Clean | |
| DRY-Trion | P2-01000 | Trion RIE Etcher | Semi-Clean | |
| DRY-Metal-1 | P2-01000 | AST Metal Etcher | Semi-Clean | |
| DRY-Metal-2 | P2-01000 | Oxford Aluminum Etcher | Semi-Clean | |
| DRY-GaN | P2-01000 | GaN Etcher | Non-Standard | |
| DRY-GaN-2 | P2-01000 | Oxford GaN-InP Etcher | Semi-Clean * | |
DRY-RIE-1 |
EC-01000 |
Oxford RIE Etcher |
Non-Standard |
|
| DRY-RIE-2 | P2-01000 | NFF RIE Etcher | Semi-Clean | |
DRY-Cleaner |
P2-01000 |
Diener Plasma Cleaner |
Non-Standard |
Microfluidic user only |
Photoresist O2 Asher |
||||
| DRY-PR-1 | P2-01000 | PS210 Asher | Clean | |
| DRY-PR-2 | P2-01000 | IPC 3000 Asher #1 | Semi-Clean | |
| DRY-PR-3 | P2-01000 | IPC 3000 Asher #2 | Non-Standard | |
DRY-PR-4 |
EC-01000 |
IPC 3000 Asher #3 |
Non-Standard |
|
Sputtering & Evaporation |
||||
| SPT-3180 | P2-01000 | Varian 3180 Sputter | Semi-Clean | |
| SPT-NSC3000 | P2-01000 | NSC3000 Sputter | Semi-Clean | |
| SPT-CY1 | P2-01000 | NFF-CY Sputter #1 | Semi-Clean | |
SPT-EV1 |
NDL-10000 |
Cooke Evaporator #1 |
Semi-Clean |
|
| SPT-ARC | P2-01000 | ARC-12M Sputter | Non-Standard | |
| SPT-CVC | P2-01000 | CVC-601 Sputter | Non-Standard | |
SPT-EV2 |
EC-01000 |
Cooke Evaporator #2 |
Non-Standard |
|
SPT-AST600 |
EC-01000 |
AST 600EI Evaporator |
Non-Standard |
|
SPT-AST450 |
EC-01000 |
AST 450I Evaporator |
Non-Standard |
|
3. Wet Etching and CMP Module
Process
Code |
Location |
Equipmment |
Cleanliness Level |
Remark |
CMP |
||||
| CMP-2 | P2-10000 | USI Wafer Cleaner | Clean | |
CMP-3 |
Rm. 2227 |
Silicon Grinder |
Semi-Clean |
|
CMP-4 |
Rm. 2227 |
Buehler Polisher #1 |
Semi-Clean |
|
CMP-5 |
Rm. 2227 |
Buehler Polisher #2 |
Non-Standard |
|
CMP-6 |
NDL-10000 |
GnP CMP |
Clean |
|
Wet-station |
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| Wetstation A - Sulfuric Cleaning Station | ||||
| WET-A1 | P2-01000 | A1: Sulfuric Cleaning (NFF reserved) | Clean | |
| WET-A2 | P2-01000 | A2:HF:H20 (1:50) | Clean | |
| WET-A3 | P2-01000 | A3: Sulfuric Cleaning | Clean | ONLY for "Clean" furnace and RTP |
| SRD-A | P2-01000 | Spin Dryer-A | Clean | |
| Wetstation B - Sulfuic Cleaning/Decontamination Station | ||||
| WET-B1 | P2-01000 | B1:Sulfuric Cleaning | Clean | NOT for "Clean" furnace and RTP |
| WET-B2 | P2-01000 | B2:HF:H20(1:50) | Clean | |
| WET-B3 | P2-01000 | B3:Decontamination | Clean | |
| SRD-B | P2-01000 | Spin Dryer-B | Clean | |
| Wetstation C - Oxide/Nitride Etching Station | ||||
| WET-C1 | P2-01000 | C1:Nitride Strip | Clean | |
| WET-C2 | P2-01000 | C2:Oxide Deglaze/PSG Removal | Clean | |
| WET-C3 | P2-01000 | C3:BOE | Clean | |
| SRD-C | P2-01000 | Spin Dryer-C | Clean | |
| Wetstation D - Semi-Clean Metal Processing Station | ||||
| WET-D1 | P2-01000 | D1:Aluminum Etch | Semi-Clean | |
| WET-D2 | P2-01000 | D2:HF:H2O(1:100) MILC | Semi-Clean | |
| WET-D3 | P2-01000 | D3:General Purpose | Semi-Clean | |
| WET-D4 | P2-01000 | D4:Sulfuric Cleaning for MILC | Semi-Clean | |
| SRD-D | P2-01000 | Spin Dryer-D | Semi-Clean | |
| Wetstaton E - Semi-Clean Non-metal Processing Station | ||||
| WET-E1 | P2-01000 | E1:ITO Etch | Semi-Clean | |
| WET-E2 | P2-01000 | E2:General Purpose | Semi-Clean | |
| WET-E3 | P2-01000 | E3:HF:H2O(1:100) | Semi-Clean | |
| WET-E4 | P2-01000 | E4:Resist Strip | Clean/Semi-Clean | |
| SRD-E | P2-01000 | Spin Dryer-E | Clean/Semi-Clean | |
| Wetstation F - Non-Standard Processing Station | ||||
| WET-F1 | P2-01000 | F1:General Purpose | Non-Standard | |
| WET-F2 | P2-01000 | F2:General Purpose | Non-Standard | |
| WET-F3 | P2-01000 | F3:General Purpose | Non-Standard | |
| SRD-F | P2-01000 | Spin Dryer-F | Non-Standard | |
| Wetstation G - TMAH Etching Station | ||||
| WET-G1 | P2-01000 | G1:TMAH | Clean | |
| WET-G2 | P2-01000 | G2:TMAH | Clean | |
| SRD-G | P2-01000 | Spin Dryer-G | Clean | |
| Wetstation J - TMAH/KOH Etching Station | ||||
| WET-J1 | P2-01000 | J1:TMAH/KOH Etching | Non-Standard | |
| WET-J2 | P2-01000 | J2:TMAH/KOH Etching | Non-Standard | |
Wetstation M - Non-Standard Organic Solvent Station |
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WET-M1 |
EC-01000 |
M1:MS2001 Resist Strip |
Non-Standard |
|
WET-M2 |
EC-01000 |
Branson 5510 |
Non-Standard |
|
WET-M3 |
EC-01000 |
M3:MS2001 Mask Cleaning |
Non-Standard |
|
Wetstation O - Non-Standard Hydrochloric Acid Etch Station |
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WET-O1 |
EC-01000 |
O1: HCl |
Non-Standard |
|
| Wetstation W - Non-Standard Organic Solvent Station | ||||
| WET-W1 | P2-00100 | W1:MS2001 Resist Strip | Non-Standard | |
| WET-W2 | P2-00100 | W2:FHD-5 | Non-Standard | |
| SRD-W | P2-00100 | Spin Dryer-W | Non-Standard | |
| Wetstation X - Clean Organic Solvent Station | ||||
| WET-X1 | P2-00100 | X1:General Purpose | Clean | |
| WET-X2 | P2-00100 | X2:General Purpose | Clean | |
| Wetstation Y - Semi-Clean Organic Solvent Station | ||||
| WET-Y1 | P2-00100 | Y1:MS2001 Resist Strip | Semi-Clean | |
| WET-Y2 | P2-00100 | Y2:MS2001 Mask Cleaning | Semi-Clean | |
| SRD-Y | P2-00100 | Spin Dryer-Y | Semi-Clean | |
| Wetstation Z - Semi-Clean/Non-Standard Organic Solvent Station | ||||
| WET-Z1 | P2-00100 | Z1:FHD-5 | Semi-Clean | |
| WET-Z2 | P2-00100 | Z2:Dump Rinser | Semi-Clean/Non-Standard | |
Critical Point Dryer |
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CPD-1 |
NDL-10000 |
Critical Point Dryer |
Semi-Clean |
|
Electroplating |
||||
EP-1 |
Rm. 2227 |
Copper Electroplating |
Non-Standard |
|
4. Photolithography Module
Process
Code |
Location |
Equipmment |
Cleanliness Level |
Remark |
| Ultrasonic Bath | ||||
| PHT-U1 | P2-00100 | Branson 5510 | Semi-Clean | |
| PHT-U2 | P2-00100 | Branson 3510 | Non-Standard | |
| Stepper/Aligner and Bonder | ||||
| PHT-A7 | P2-00100 | Karl Suss MA6 #2 | Clean/Semi-Clean | |
| PHT-S1 | P2-00100 | ASML Stepper | Clean/Semi-Clean | |
PHT-A1 |
NDL-10000 |
AB-M Aligner #1(UV)/(DUV) |
Semi-Clean/Non-Standard |
|
| PHT-A2 | P2-00100 | AB-M Aligner #2(UV) | Semi-Clean/Non-Standard | |
PHT-A5 |
EC-01000 |
Karl Suss MA6 #1 |
Non-Standard |
|
| PHT-B2 | P2-00100 | Karl Suss Bonder XB8 | Non-Standard | |
| PHT-B3 | P2-00100 | SET ACCµRA100 Flip-Chip Bonder | Non-Standard | |
EMW-1 |
EC-01000 |
JEOL JBX-6300FS E-Beam Lithography System |
All Level |
|
| PHT-P1 | P2-01000 | Nanoscribe 3D Printer | All Level | |
| Coater and Track | ||||
| PHT-T1 | P2-00100 | SVG88 Coater Track | Clean/Semi-Clean | |
| PHT-T2 | P2-00100 | SVG88 Developer Track | Clean/Semi-Clean | |
| PHT-SC3 | P2-00100 | CEE Coater | Clean/Semi-Clean | |
| PHT-SC1 | P2-00100 | SUSS Coater | Semi-Clean/Non-Standard | |
| PHT-SC2 | P2-00100 | Desktop Coater | Non-Standard | |
| PHT-SC5 | P2-00100 | EVG Spray Coater | All Level | |
PHT-SC4 |
EC-01000 |
Solitec Coater #1 |
Non-Standard |
|
PHT-SC6 |
P2-01000 |
Laurell PDMS Coater |
Non-Standard |
Microfluidic user only |
PHT-MX1 |
P2-01000 |
Kurabo PDMS Mixer/Deaerator |
Non-Standard |
Microfluidic user only |
| Oven | ||||
| PHT-O3 | P2-00100 | Imperial V (105C) | Clean/Semi-Clean | |
| PHT-O4 | P2-00100 | Oven-C (120C) | Clean/Semi-Clean | |
| PHT-O6 | P2-00100 | Oven-A (180C) | Clean/Semi-Clean | |
| PHT-O7 | P2-00100 | Oven-B (80C) | Clean/Semi-Clean | |
| PHT-O1 | P2-00100 | Grieve | Non-Standard | |
| PHT-O2 | P2-00100 | Shellab (120C) | Non-Standard | |
| PHT-O5 | P2-00100 | Vacuum Oven | Non-Standard | |
PHT-O8 |
EC-01000 |
Oven-D (120C) |
Non-Standard |
|
PHT-O9 |
EC-01000 |
Oven-E (105C) |
Non-Standard |
|
PHT-O10 |
P2-01000 |
Oven-F (80C) |
Non-Standard |
Microfluidic user only |
| PHT-O11 | P2-01000 | Unitemp Reflow Oven | Non-Standard | Flip Chip user only |
| Hotplate | ||||
| PHT-HP1 | P2-00100 | Sawatec Hot Plate | Clean/Semi-Clean | |
| PHT-HP2 | P2-00100 | SUSS Hot Plate | Clean/Semi-Clean | |
| PHT-HP9 | P2-00100 | CEE Hot Plate #1(110C) | Clean/Semi-Clean | |
| PHT-HP3 | P2-00100 | Hot Plate-C | Non-Standard | |
| PHT-HP4 | P2-00100 | Hot Plate-D | Non-Standard | |
PHT-HP5 |
EC-01000 |
EMS Hot Plate #1 (50C) |
Non-Standard |
|
PHT-HP6 |
EC-01000 |
CEE Hot Plate #2 (90C) |
Non-Standard |
|
PHT-HP7 |
EC-01000 |
Hot Plate (110C) |
Non-Standard |
|
| PHT-HP8 | P2-00100 | EMS Hot Plate #2 (50C) | Non-Standard | |
| HMDS Primer | ||||
| PHT-HM1 | P2-00100 | HMDS Primer #1 | Non-Standard | |
| PHT-HM2 | P2-00100 | HMDS Primer #2 | Clean/Semi-Clean | |
PHT-HM3 |
EC-01000 |
HMDS Primer #3 |
Non-Standard |
|