Wet Etching and CMP Module

Wetstation A, B, C, D, E, F, G and H
Clean/Semi-clean/Non-Standard

WET-A1 to WET-A3, WET-B1 to WET-B3, WET-C1 to WET-C3, WET-D1 to WET-D4,
WET-E1 to WET-E4, WET-F1 to WET-F3, WET-G1 to WET-G2, WET-H1 to WET-H3

Specifications
Wet processing : Silicon Etch using KOH / TMAH (25%)
Photoresist Strip / ITO Etch
Aluminum Etch / Pad Oxide Etch
Oxide / Nitride Etch
Wafer Cleaning (RCA)
Wafer Cleaning (Piranha Clean)
Solvent Cleaning

Wetstation A and B

Wetstation C and D

Wetstation E and F

Wetstation G and H
 
Wetstation M (WET-M1 to WET-M3)
Non-Standard
Wetstation M (WET-M1 to WET-M3)
Specifications
MS2001 Resist Stripper
FHD5 Manual Developer
Quick Dump Rinsers
Small samples up to 6”
 
Wetstation O (WET-O1)
Non-Standard
Wetstation O (WET-O1)
Specifications
Hydrochloric Acid Etch Prior E-Beam Metallization
DI Water Gun for rinse
N2 Gun for dry
Small samples up to 6"
 
Wetstation W, X, Y and Z (WET-W1 to WET-W2, WET-X1 to WET-X2, WET-Y1to WET-Y2, WET-Z1 to WET-Z2)
Clean/Semi-clean/Non-Standard
Wetstation W, X, Y and Z (WET-W1 to WET-W2, WET-X1 to WET-X2, WET-Y1to WET-Y2, WET-Z1 to WET-Z2)
Specifications
MS2001 resist stripper
FHD5 manual developer
Quick dump rinsers
Small samples up to 6"
 
Strasbaugh CMP (CMP-1)
Clean
Strasbaugh CMP (CMP-1)
Specifications
Polished for Silicon dioxide or Polysilicon
4" wafer size
400-550 µm wafer thickness
Touch-screen graphical user interface
Hydrolift Loading Station
 
USI Wafer Cleaner (CMP-2)
Clean
USI Wafer Cleaner (CMP-2)
Specifications
Wafer surface scrubbing for pre-CMP and post -CMP process
Fully automatic microprocessor control
Completely enclosed chamber for washing, rinsing and drying
4" wafer cleaning
9" brush travel
Silicon Grinder (CMP-3)
Semi-Clean
Silicon Grinder (CMP-3)
Specifications
Mechanical grind for Silicon Oxide or Silicon using diamond wheel
>5mm2 to 4" wafer size
100-800um wafer thickness
 
 
 
Buehler Polisher #1 (CMP-4)
Semi-Clean
Buehler Polisher #1 (CMP-4)
Specifications
Polished for Silicon, Silicon Oxide or Silicon Nitride
>5mm2 to 4" wafer size
100-800um wafer thickness
 
 
 
Buehler Polisher #2 (CMP-5)
Non-Standard
Buehler Polisher #2 (CMP-5)
Specifications
Polished for Copper, CNT, Silicon, Silicon Oxide or Silicon Nitride
>5mm2 to 4" wafer size
100-800um wafer thickness
 
 
 
Copper Electroplating (EP-1)
Non-Standard
Copper Electroplating (EP-1)
Specifications
Copper Electroplating on 2" single side or 4" single/double sides wafer size
Ready for Copper Electroplating to fill the small trench 300-550um wafer thickness
 
 
 
 
 
Wetstation Map (Click on the "Squares" below to view the details of each wetstation or click HERE to enlarge the map)
 A3A2A1B3B2B1 J2 J1 G2 G1 F1 F2 F3 E1 E2 E3 E4 D1 D2 D3 D4 C1 C2 C3 Z2 Z1 Y2 Y1 W2 W1 X2 X1
NFF provides not a few wet-processing baths for users to do their process. Though most of the chemicals used are similar, the purposes that they serve are not in the least similar. Furthermore, as all wet-processing baths are designated and arranged according to their cleanliness levels and purposes, users are not allowed to use those solutions for different purposes. In light of all this, we strongly suggest users spend some time studying the function of each wet-processing bath.
The above picture is a simplified map of wetstatations. Squares with a label, say A2, represent the wet-processing bath and the squares with some blurred lines represent dump-rinsers. For more details of each bath, click on the corresponding square.